Packaging Engineer

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S MTS PACKAGING ENGINEER

THE ROLE:

Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements.

THE PERSON:

This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly.

KEY RESPONSIBILITIES:

• Drive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables. • Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs. • Establish ecosystem partners to identify assembly capability improvement roadmap

PREFERRED EXPERIENCE:

• Demonstrated leadership skills in managing OSATs and teams with various backgrounds • In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc.. • Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience. • Well verse in typical technology development tools, FMEA, SPC, control plans, etc.. • Ability to communicate well in both English and Chinese language

ACADEMIC CREDENTIALS:

• Minimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.

LOCATION:

Hsinchu, Taiwan